Sputtering Target Bonding

Sputtering Target Bonding

Sputtering target bonding is an important process to insure the thermal integrity of the interface between a sputter system cooling mechanism and the surface of the sputtering target.  Understanding this importance and the specialty materials being manufactured, Materion offers target to backing plate bonding for its customers.

Materion’s complete bonding service utilizes traditional as well as custom metallic alloy solder techniques.  These techniques allow Materion to bond targets of a variety of compositions and configurations such as planar and rotary.  Highly refined processes have been developed by Materion to address bonding target materials to backing plates which have a high degree of difference in their thermal properties (such as CTE), allow for a broad range of operating temperatures and ease of target recycling.

A complete refining and recycling service is also made available for precious metal containing targets.  This service acts to reduce the cost of ownership through materials recovery.

Sputtering Target Bonding Is Offered By:

• Advanced Chemicals
• Microelectronics & Services