Resources

1. Aircraft Electronic Modules AlBeMet A Key Ingredient in the F-22 Central Computer

   AlBeMet®’s low weight, high strength and unmatched thermal properties make it a crucial production material for aircraft electronics, especially for performance-demanding tactical aircraft such as the F-22 Fighter.

2. Be and Be Composites for Electronic Substrate Material

   Using beryllium and beryllium composites as material for electronic substrates offers significant advantages to design engineers, including high thermal conductivity, high elastic modulus, low density and a very compatible thermal expansion match for chip carriers.

3. Beryllium Metal Matrix Composites for Electronic Packaging Systems

   Customers seeking electronic packaging materials with tailorable thermal, physical, and mechanical properties will find that Materion’s high-performance beryllium metal matrix composites are ideally suited for a variety of applications, particularly those requiring high thermal conductivity and low weight.

4. Beryllium Metal Matrix Composites for Avionics Materials

   Sophisticated aircraft and satellite avionics systems require high-performance materials. Materion Brush Beryllium & Composites' family of metal matrix materials, AlBeMet^®; and E-Materials, offer designers a superior combination of mechanical, physical, and thermal properties.

5. Beryllium Metal Solves Thermal Management Challenges for High Performance Electronic Packaging Applications

   Beryllium’s properties provide electronic design engineers with solutions to thermal management challenges in a multitude of electronics applications. As the metal of choice for high-density electronic packaging applications, beryllium supplies a moderating coefficient of thermal expansion, high thermal conductivity, low density and high stiffness.

6. Lightweight Beryllium Composite Heat Sink offer Thermal System Performance on Advanced Electronic Packaging

   Advances in commercial and military electronics have created a need for electronic packaging materials that have thermal cycle reliability over a broad temperature range. Beryllium-based metal matrix composites are ideally suited for even the most demanding packaging needs.