Wireless
Consumer Electronics
Wireless
Materion Corporation has witnessed firsthand the dramatic growth in technology and applications for wireless devices. We remain at the forefront of technical advances, and work in partnerships with industry innovators to develop solutions to common demands like higher power and frequencies.
Materion Corporation offers a wide array of solutions for the wireless industry including high performance alloys, thin film deposition materials, specialty alloy connectors and specialized assembly and packaging materials.
Designers turn to Materion Corporation’s copper alloys for the electrical terminal contacts in connectors critical to the functioning of today’s cell phones and other mobile devices, due to the alloys’ superior strength, formability, electrical conductivity and spring memory. Materion Corporation copper alloys enable consumer electronics products to be further miniaturized while converging multiple functions – phone, camera and MP3 players – into a single, more reliable device with a longer working life.
For wireless applications, we also provide a complete array of thin film materials. Our proprietary EVAPro™ process technology produces higher yields when evaporated onto compound semiconductor wafers, minimizing defects caused by splattering. EVAPro™ evaporation materials contain ultralow gas entrapments that ensure defect-free devices.
SFG™ Sputtering Target Process
In addition, our SFG™ thermo mechanical process is used to produce a sputtering target with optimal grain size and crystal orientation. The randomly orientated and equiaxed grain structure developed using the SFG™ process eliminates any preferred sputtering of the target material, ensuring that the coated substrate will have the uniform and required properties.
VCT™ Casting Technology
Our VCT™ casting technology, which ensures small, randomly orientated grain and 100% alloy homogeneity during casting, is used for brittle material such as gold/germanium, gold/tin, and gold/zinc.
Additional Materion Corporation Wireless Consumer Electronics Processes
A full array of backing plate designs and internal services, such as the ability to replace, refurbish, repair and design backing plates using CAD/CAM, are also offered. With target bonding facilities located throughout the world, we can supply industry-leading bonding services and assure minimized shipping logistics.
Finally, Materion Corporation provides a variety of hermetic lids, gold, tin and indium preforms, and bonding wire and ribbon for assembly and packaging of high reliability applications.
Our in-house precious metal refining and recycling program, which includes spent targets, chamber scrapings and coated precision parts cleaning, allows us to offer a lower cost to all of our valued customers.
Wireless Infrastructure and Applications
Our materials help keep customers connected throughout the telecommunications infrastructure. Beryllia ceramics – known for their high thermal conductivity, excellent electrical insulation and resistance to chemical corrosion - provide an ideal materials solution for various applications in the telecommunications sector.
In electronic semiconductor chip packaging for wireless and Internet infrastructures, ceramic materials protect the components and entire systems from the crippling effects of intense levels of heat. Base station and server bandwidth continue to rapidly drive the need for smaller, high precision RF connectors. Copper beryllium rod can easily be machined into these intricate shapes. The material’s high strength allows the contacts to be mated thousands of times while maintaining dimensional stability.
The Materion Corporation Difference in Consumer Wireless and Telecom Infrastructure
Interested in learning more on Materion Corporation’s vast experience in the consumer wireless industry? Contact Materion Corporation to find out more.
Consumer Electronics - Wireless Solutions are Offered By: