Telecom Infrastructure

Materion Corporation assists customers in the telecommunications infrastructure market to improve end-use product performance while lowering total costs.

The Materion Corporation Solution

As the world's leading resource for engineered, specialty strip metal solutions, copper beryllium rod and wire products, Materion Corporation offers the widest range of reel-to-reel and screw machinable products for a variety of high-performance applications. Our comprehensive metal systems capabilities include non-precious and precious metal cladding and electroplating.

Materion serves the infrastructure supporting telecom with high power thermal materials, high performance alloys, beryllium oxide ceramics and electronics packaging materials. Our materials provide reliability and durability, thermal management, high power transmission and magnetic isolation.

To our telecommunications infrastructure customers, we provide material solutions:

For improved radio frequency applications such as cell phones and base stations, our BeO ceramics are useful in heat-producing circuits such as those carrying high currents or that have very dense circuitry. Beryllia ceramic's low dielectric constant allows for improved electrical performance, particularly at higher frequencies.
For telecommunications backplane connectors used in switching systems, a typical base material is C 725(CuNi9Sn2). Depending on the coating technology, we typically use WE#1 (AuAg25Pt6) for clad materials and apply hard gold for electroplating materials.
Beryllium copper alloys, such as C 172 and C 174, are the high performance materials of choice for battery contacts in cellular phones. If wear is an issue in the contact area, the use of an inlay of palladium nickel 20 inlay alloy is recommended. Alternatively, hard gold can be applied by selective/stripe electroplating in the contact area to provide a reliable connection.
Beryllium copper alloy, C173 (or M25), is the highest strength, free machining copper alloy available commercially. Its strength and conductivity combination makes it ideal for use in RF coaxial connectors for wireless base station and antenna contacts.
Our aluminum base, double tin and copper overlay shielding materials for cellular phones can provide a significant weight advantage over steel and nickel silver alloys, which are commonly used for this type of application.

Clad Metals

Materion Corporation provides industry-leading materials and technologies to deliver high-performance, cost-effective solutions.

Our clad metals are reliable and competitively priced. They offer excellent wire bondability, superior formability and temperature stability to 350°C, and their multiple layers allow the expensive gold layer to be minimized.

Our electroplating technology gives us the unique capability to combine electroplating and metallurgical processes along with the availability of rolling, heat treating, slitting and leveling equipment to enhance or modify an electroplated strip.

Telecommunications Infrastructure Solutions

Our innovative metals technology can help solve your telecommunications infrastructure applications problems, contact Materion Corporation today.

Materion Corporation is a world class manufacturer of filters for telecommunications applications. Our state of the art technology, customizable solutions and cost effective manufacturing makes Materion the number one choice for hardware manufacturers for applications such as:

CWDM
Multiplexers/demultiplexers
OADM
Optical amplifiers/EDFA
Triplexer (voice, data, video)