Semiconductor Equipment

Defense & Science

Semiconductor Equipment

As a leading supplier of thin film deposition materials, Materion Microelectronics & Services has focused our efforts on providing thin film deposition materials for UBM and application specific semiconductor (ASIC) manufacturers. Recognizing the need for a partner with leading edge material technology combined with a low manufacturing cost base and global footprint, Materion Microelectronics & Services has developed comprehensive thin film and semiconductor packaging product offerings focused on providing superior cost of ownership.

Materion Microelectronics & Services has focused our global production, sales and technical staff to focus on both Front Side and Back Side wafer applications.

Materion Microelectronics & Services thin film materials technology is backed by collaborative technical support that is available to aid customers trouble shooting a problem or developing new processes. Customers are encouraged to use our technical support network consisting of:

Applications Support (Including in-house fab support)
Metallurgical Support
Process Engineering Support

The manufacture of today's semiconductor devices requires consistent and controlled products made to the highest quality standards. Using state of the art production facilities techniques, Materion Microelectronics & Services controls our critical manufacturing variables so products are manufactured to the highest quality standards attainable, always meeting or exceeding customer or OEM requirements.

Under Bump Metallization (UBM) and Redistribution Layer (RDL)

Materion Microelectronics & Services has become the customer’s first choice in a partner when developing solutions for advanced packaging applications requiring thin film metallization. We have collaborated with our customers and industry to develop specific grades of materials and specifications that enable our customers to be successful in this competitive market.

To provide the optimum ratio of superior performance to cost, Materion Microelectronics and Services has designed a series of UBM Grade™ thin film deposition materials for each of the leading bump technologies:

Materion Microelectronics & Services supports each of these technologies with a combination of products, including:

Sputtering targets
Evaporation materials
Plating Anodes

Since the UBM process is nearly the last step in the production of a semiconductor device, the quality requirements are demanding any lost yield results in substantial loss of revenue. To meet the stringent demands of this industry, Materion Microelectronics & Services has developed optimized UBM materials that display a uniform, fine grain size that improves overall thin film uniformity. Gaseous impurities have also been further reduced, resulting in extremely consistent thin film electrical properties. All of this adds up to enhanced device performance and greater wafer yield.

Sputtering materials are produced in a wide array of shapes and sizes to meet the requirements of virtually any sputtering tool design. Materion has developed SFG™, a process to produce sputtering targets with optimal grain size of 100 microns or less. SFG™ ensures greater thin film yields (uniformity) and maximizes target utilization.

Thermal (resistive) and E- beam evaporation processes are enhanced with our EVAPro™ material. EVAPro™ is Materion's proprietary technology that causes ultra-low internal gas entrapments and ensures the lowest defect count per wafer, from the initial soaking time to the last evaporation run. Materion also offers a full array of backing plate designs and internal services, including the ability to replace, refurbish, repair and design backing plates using CAD/CAM. Our target bonding facilities are located throughout the world, supplying industry-leading bonding services while minimizing shipping logistics.

Our in-house precious metal refining and recycling program includes: spent targets, spent evaporation crucibles, chamber scrapings, coated shield kit and parts cleaning. The utilization of this program results in significantly lower cost and minimized precious metal inventory.

Traditional Semiconductor Materials for ASIC

As a proven leader in semiconductor sputtering target technology, Materion Microelectronics & Services offers a comprehensive range of thin film deposition materials for all major semiconductor applications including:

With our extensive metallurgical knowledge, Materion Microelectronics & Services also has the ability to tailor alloys to customer specific requirements. Materion Microelectronics & Services supports all major OEM platforms for wafer requirements. OEM platforms supported include:

Applied Materials™
Novellus™ (Varian™ )
Unaxis™ (Balzers™ )
Aviza (Trikon™) K
DF™ (MRC™ )
Metron™ (MRC™ )
SFI™
Ulvac™

Materion Microelectronics & Services also offers a full array of backing plate designs and internal services, including the ability to replace, refurbish, repair and design backing plates using CAD/CAM. Our target bonding facilities are located throughout the world, supplying industry-leading bonding services while minimizing shipping logistics.

Materion Beryllium Oxide

In semiconductor manufacturing, leading companies continue to push the envelope on equipment precision and reliability. BeO’s thermal conductivity and chemical stability make it very desirable material for the manufacture of material vapor deposition equipment components. By utilizing BeO, manufacturers can shrink bible times, improve reliability and eliminate contamination problems due to outgassing problems which are common to other competing materials such as pyrolytic boron nitride (BPD). Beryllium oxide has proven to be especially valuable in the II-V material set where crucibles and other components made from BeO are found in many applications.