Metallization
Beryllium oxide ceramics can be metallized and subsequently plated by electrolytic (rack or barrel) or electroless processes. Metallization is most commonly moly-manganese that can then be plated with a variety of metals, including nickel, gold, silver and copper. Metallization can also be applied in patterns for more intricate designs. In many instances, metallization is applied by hand. Machined parts can also be metallized, which permits the ceramics to be attached to other components by methods such as brazing or soldering. Metallizing is required when a bond between the ceramic and another component is needed. The coating is a thick film, refractory metallization containing Molybdenum, Manganese, and other ingredients. When sintered, the metallizing will facilitate a strong, hermetic bond to the ceramic body. The non-metallic components in the metallization matrix will penetrate the grain boundaries of the ceramic, supplementing its strength. The sintered layer is electrically conductive allowing subsequent plating. Depending on part shape, size, and complexity the metallization layer may be applied using one of several techniques. These include screen-printing, pinstriping, roll coating, air brushing, dipping, brushing, or by syringe. Layer thickness is typically between 300 and 900 microinches thick but can be increased with multiple applications. Positional tolerances of metallization patterns will also depend on the part complexity and application technique used.
Metallization Is Offered By: