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LED

LEDs (Light Emitting Diodes) and High Brightness (HB LED's) have experienced tremendous growth during the last decade. Incredible amounts of research and development have yielded numerous applications for LEDs including: traffic control lights, instrumentation illumination, backlit displays, automotive lights, fiber optic applications, and more recently the general lighting market.

Materion provides enabling and advanced materials technologies and services that are intrinsically involved in the production of LEDs.  Sputtering targets featuring SFG™ technology and evaporation materials featuring EVAPro™ technology are used for metallization of the wafers at the contact surface. Materion also supports the manufacture of LEDs with a full array of materials including TiW,Cr,Pt, Pd,Cr, and Ni.   As the market adapts to using thin film AuSn or AuGe for attachment metallization, Material has developed AuSn and AuGe sputtering targets featuring VCT™ technology.  Traditional AuSn and AuGe preforms can also be used for this application.

Since the LED market consumes vast amounts of precious metals, Materion has developed a comprehensive total solutions approach, including thin film materials, packaging materials, precision parts cleaning and refining services for all precious metal photonics applications.  Materion is the only vertically integrated materials provider with refining and precision parts cleaning.  This vertical integration and solutions based approach ensures the best-cost to our customers.

Materion also offers a full array of backing plate designs and internal services including the ability to replace, refurbish, repair and design backing plates using CAD/CAM. With target bonding facilities throughout the world, Materion assures industry leading bonding services and minimized shipping logistics.

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