Direct Bond Copper

Direct Bond Copper

High purity copper sheets 0.010" or 0.012" (250 or 300 microns) thick can be directly bonded to BeO or alumina substrates by the direct bond copper process, which involves the materials being bonded by a ternary phase of Be-Cu-O and Al-Cu-O.  

The result is a strong, hermetic bond of thick copper for applications requiring low thermal resistance and high current-carrying capabilities. Plates of alumina or BeO are blanket bonded on both faces with Cu, and then the Cu is photoetched into the desired pattern. After patterning, the copper can be plated with Ni and Au.  

Sizing Options

• Ceramic thickness: 0.025" or 0.040"
  • Ceramic plate sizes:
    • 96% Alumina: up to 6.5" x 5.4"
    • 99.5% Beryllia: up to 2.0" x 2.0"

• Conductor lines and spaces: 0.020" min.
  • Tolerance: +/- .005"
  •  Cu thickness: .010" or .012"
  • Electroless Ni plating thickness: 80 to 250 microinches
  • Electroless Au plating thickness: 2 to 120 microinches

Contact Us

For more information about direct bond copper, contact Materion Microelectronics & Services today.