Microelectronic Packaging Materials
Microelectronic Packaging Materials
For over 30 years, Materion MIcroelectronics & Services has supplied high reliability packaging materials to the microelectronics industry. We continue to be a leading and dependable source of packaging material solutions including:
- Gold bonding wire
- Near Hermetic cover lids including Combo Lids®
- Gold and silver bonding ribbon
- Solder preforms
Our product offering also includes ceramic air cavity and BeO packages, CuPacks™, plated flanges, ceramic substrates (direct bond copper and metallized ceramic).
At Materion Microelectronics & Services, we are leaders in providing engineered solutions for ceramic packages and hermetic cover/lids. Our tooling libraries for solder preforms and ceramic packages are extensive, and our state-of-the-art manufacturing sites around the world offer industry-leading lead times and unsurpassed customer service. Our products are produced in the USA, Singapore and the Philippines depending upon the configuration, application and volume requirements.
Contact Us
To learn more about the microelectronic packaging materials offered, contact Materion Microelectronics & Services today.