Resources

1. Bonding Wire Spool Removal

2. Bondability Reliability and Yield Benchmarks for High Volume Speciality Gold Fine Bonding Wire

   As wire bonding becomes increasingly difficult, the physical and chemical characteristics of the wires used become even more important. Researchers discovered that using certain dopants in the appropriate amounts allowed for the development of alloys with low loop and long length qualities.

3. DEVELOPMENT OF LOW LOOP LONG LENGTH HYDROSTATICALLY EXTRUDED BONDING WIRE

   New developments in the microelectronics field have led to an increased demand for low loop, long length, hydrostatically extruded bonding wire. Currently, researchers are exploring what affects the addition of other elements will have on the bonding wire.

4. Gold Bonding Wire The Development of Low Loop Long Length Characteristics

   Recent developments in the microelectronics field support an increasing need for low loop and long length bonding wires. Low loop and long length bonding wire require short heat affected zone (HAZ), and high stiffness that means long lengths without undo sweep.