Bonding
Materion understands how critical the integrity of bond between target and backing plate is. Not only for good thermal transfer, but also vacuum integrity and process conditions rely on a proper bond. Materion utilizes multiple target bonding methods, including solder bonding, diffusion bonding and additional methods of high temperature bonding.
Materion provides Epoxy bonding as a service, and as a product for sale. See Silvertech PT 1 Epoxy data sheet.
We also have the capability to ultrasonically inspect the quality of bond layers.
World-wide support
We have full service target bonding facilities in Brewster NY, Buffalo NY, Santa Clara CA, Limerick Ireland and Taiwan.
Full OEM Support
A partial list of equipment platforms we routinely bond for includes:
• Applied Materials
• Novellus
• Trikon
• Aviza
• Anelva
• Veeco
• CVC
• NEXX
• Singulus
• Unaxis
• SFI
• KDF
With world-wide sales and manufacturing, contact your local Materion representative.
Bonding Is Offered By: