Contour Profiling - Battery-Busbars

Contour Profiling - Battery-Busbars

Challenge of Application:

Ultrasonic and laser joining of dissimilar metals can be problematic -- especially between aluminum and copper where brittle intermetallics can form in the joint.

Materion Solution:

Cu-Al dovetail strips can be produced in thicknesses up to 2mm for maximum current-carrying capacity while enabling copper-to-copper and aluminum-to-aluminum bussing connections.

RELATED CHALLENGES:

• Interconnect Systems
• Metal Joining
• Thermal Management

RELATED PROCESS TECHNOLOGIES:

• Overlay Cladding
• Inlay Cladding
• Electron Beam Welding
• Contour Profiling

Contour Profiling - Battery-Busbars Is Offered By:

• Technical Materials