Electroplating - Discrete Solder Pads for Cell -to-Cell-Interconnects

Electroplating - Discrete Solder Pads for Cell -to-Cell-Interconnects

Challenge of Application:

Improve yields and increase manufacturing uptime by replacing solder pastes and preforms.

MATERION Solution:

Discrete reflowed, pre-fluxed solder pads on continuous strip or stamped interconnects offer precise volume and location control of both the solder and flux while simplifying assembly operations and extending shelf life.

RELATED CHALLENGES:

• Interconnect Systems
• Metal Joining
• Soldering/Brazing

RELATED PROCESS TECHNOLOGIES:

• Solder Coatings
• Electroplating
• Parts Fabrication

Electroplating - Discrete Solder Pads for Cell -to-Cell-Interconnects Is Offered By:

• Technical Materials