Electroplating - Gold Contacts on Copper Beryllium

Electroplating - Gold Contacts on Copper Beryllium

Challenge of Application:

Supply a stable electrical contact with excellent spring characteristics, stress relaxation, and good electrical conductivity.  These parts normally require severe forming.

Materion Solution:

We can supply CuBe materials with multi-layer Au alloy or diffused Au clad inlays.  Selective Au electroplating is also available for less demanding physical and thermal applications.  These materials can be supplied in either pre-hardened or post-hardened conditions.

RELATED CHALLENGES:

• Interconnects
• Electrical Switching

RELATED PROCESS TECHNOLOGIES:

• Inlay cladding
• Overlay cladding
• Electroplating

Electroplating - Gold Contacts on Copper Beryllium Is Offered By:

• Technical Materials