Inlay Cladding
Using the same metallurgical bonding technology as with overlays, Materion Technical Materials can also produce inlay stripes with various alloys. Inlays are bonded into profiled substrates. This creates stripes as thin as 1% or as thick as 55% of the total substrate thickness. Multiple stripes can be located across the width of both the top and bottom surfaces. Often stripes are composed of multiple alloy layers for functionality. Examples of this approach are seen in high-temperature electronic connectors where a stripe is capped with 0.25 micron Au on 2 microns of PdAg on top of a 4 micron Nickel diffusion barrier. This is then inlaid into a Copper alloy substrate. Inlays offer design options for reducing total cost when using expensive alloys.
Types of Inlay Cladding Offered: