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Implantable Interconnects

Inlay Cladding

 

Implantable Interconnects

Challenge of Application:

Implantable devices often require connections between dissimilar metals. For cardiac and neural implants, the robust interconnects between Titanium-based power sources and Niobium lead wires create laser welding challenges. 

Materion Solution: 

Bimetal components fabricated using TECHNICAL MATERIALS’ electron beam weld and inlay cladding processes simplify and improve welding reliability in OEM device assembly by eliminating dissimilar metal welding.

RELATED CHALLENGES:

RELATED PROCESS TECHNOLOGIES:


Implantable Interconnects Is Offered By: