Wirebondable Leadframes - Gold Plating

Wirebondable Leadframes - Gold Plating

Challenge of Application:

A material system that will allow robust fine gold wire bonding inside hybrid packages as well as support the output terminal requirements. 

Materion Solution: 

Supply a pure soft gold plated or clad on to copper alloy strip that can also have various terminal coatings -- ie. Au, Sn, Ni, Ag 

RELATED CHALLENGES:

• Interconnect Systems
• Wire Bonding

RELATED PROCESS TECHNOLOGIES:

• Inlay Cladding
• Electroplating
• Gold Recovery

Wirebondable Leadframes - Gold Plating Is Offered By:

• Technical Materials