Wirebondable Leadframes - Aluminum Inlay

Wirebondable Leadframes - Aluminum Inlay

Challenge of Application:

Flexibility of interconnecting different types of bondable metals in dense packages.

Materion Solution:

Technical Materials offers a wide variety of wire bondable surfaces, whether it be Cu or Au ball, Al, Au or Cu wedge.

Aluminum inlay systems represent the most robust leadframe system with broad processing parameters and excellent shelf life.  This system exceeds requirements of the most critical applications using aluminum wires and ribbons.

RELATED CHALLENGES:

• Interconnect Systems 
• Thermal Management 
• Wire Bonding 
• Worldwide Availability
• Metal Joining 

RELATED PROCESS TECHNOLOGIES:

• Overlay Cladding 
• Inlay Cladding 
• Electroplating 
• Hybrid Processing

Wirebondable Leadframes - Aluminum Inlay Is Offered By:

• Technical Materials