Solder Coating Applications

Solder Coating Applications

Materion Technical Materials offers three separate technologies for continuous solder coating of strip metals.  Print-on and thermal reflow technologies provide all solder alloy compositions in selective locations on copper alloy substrates.  These solders can be deposited in thicknesses up to 0.5 mm thicknesses.  Thinner depositions of Sn and SnPb can be continuously electroplated on strip as well.  A wide variety of solder alloys can also be clad or inlaid to create otherwise impossible combinations and geometries of solder and substrates.

Types of Solder Coating Applications Offered:

• Solder Coating - Discrete Solder Pads for Cell-to-Cell Interconnects
• Solder Coating - Glass Connections-Glass Compliant Solders
• Solder Coating - Resistors- High Power Shunts
• Solder Coating - Thermal Management-Copper Clad Aluminum
• Solder Coating - Ultra-Thin Solar Collection Tapes

Solder Coating Applications Is Offered By:

• Technical Materials