Semiconductor Equipment
The Semiconductor Equipment Market
Materion Corporation has extensive experience throughout the growing semiconductor arena, serving original equipment makers (OEM) from several of our businesses. Materion Brush Beryllium & Composites and Materion Ceramics are global suppliers of pure metals, metal matrix composites and ceramics to the semiconductor capital equipment marketplace, while Materion Microelectronics & Services is a leading supplier of thin film deposition materials for the compound semiconductor market and is now focused on becoming the preferred supplier of thin film deposition materials for under bump metallization (UBM) and traditional semiconductor manufacturers.
Solutions from Brush Beryllium & Composites and Ceramics
Materion Brush Beryllium & Composites' materials can dramatically benefit semiconductor manufacturing equipment, primarily by increasing productivity and lowering product costs. The use of these high damping capacity materials can advance any equipment or structure that needs to move wafers or masks rapidly, without wafer damage and providing a remarkable mean time between failure. In addition, Materion Brush Beryllium & Composites materials can operate at high temperatures with outstanding material properties to support the next advancement in semiconductor technology.
These materials can either be designed into new equipment for advancing technologies such as 450 mm wafer manufacture or large flat panel display manufacturing or they can be utilized to retrofit existing equipment to increase productivity. As the semiconductor market advances to larger and larger wafers, with smaller node resolution, Materion's advanced materials will be a key enabler. Our products can be manufactured to very precise tolerances at very competitive cost as well.
Materion Brush Beryllium & Composites applies the same exceptional product quality and commitment to customer service to the semiconductor market that it extends to its primary market: defense and aerospace. We offer not just the materials for your applications but the engineering (SPADE-Special Products Applications Development Engineering) to assist with the design and manufacture of the end-use products as well. Our SPADE engineers are available to assist you with your design needs.
Product Solutions:
Product Capabilities:
- Unparalleled specific stiffness
- High temperature operation - In some cases, two to three times that of aluminum alloys
- Great specific strength
- Excellent thermal conductivity in metal and ceramic forms
- Unique vibration damping
- Extremely stable over time and temperature to maintain planarity
- Moderate-to-low coefficient of thermal expansion (CTE)
- Low out-gassing and particulate generation
- Electrically conductive (metals)
Applications:
- Atmospheric and vacuum end effectors
- Robot struts and end fittings
- Equipment structures
- Wire bonder housings
- Wire bond capillary head
- Any static or transient high heat component within the process
The Materion Microelectronics & Services Advantage
Understanding that our customers need a supplier with leading-edge material technology capabilities and a low manufacturing cost base and global sourcing capabilities, Materion Microelectronics & Services has developed comprehensive thin film and semiconductor packaging product offerings focused on providing superior cost of ownership advantages.
We offer a comprehensive range of thin film deposition materials for all major semiconductor applications including inter connect, barrier, gate, backside and other materials and support all major OEM platforms for 200mm and smaller wafer requirements. The OEM platforms supported are as follows:
- Applied Materials™
- KDF™ (MRC™ )
- Metron™ (MRC™ )
- Novellus™ (Varian™ )
- SFI™
- Trikon™
- Ulvac™
- Unaxis™ (Balzers™ )
As more designers integrate Chip Scale Packaging (CSP) to minimize cost and improve performance of their devices, Materion Microelectronics & Services strives to become the leading thin film deposition materials supplier for the under bump metallization (UBM) layers that are critical to the performance of CSP processes.
To provide the optimum ratio of superior performance to cost, we designed a series of UBM Grade™ thin film deposition materials for each of the leading bump technologies: evaporation metallic mask, evaporation resist mask, screen printing, electroplating and conductive polymer bumps.
These materials enhance device performance and provide greater wafer yields because they are made with a uniform fine grain size that improves overall thin film uniformity. Gaseous impurities have also been further reduced, resulting in extremely consistent thin film electrical properties.
Semiconductor Equipment Manufacturing
The manufacture of today's semiconductor devices requires consistent and controlled products made to the highest quality standards. As a ISO9001:2000 supplier dedicated to continuous improvement, Microelectronics & Services provides products that meet or exceed customer specifications and OEM requirements. Given our extensive metallurgical knowledge, we also have the ability to tailor alloys to specific customer requirements. Finally, we offer our troubleshooting expertise to customers via a technical support network consisting of applications, metallurgical and process engineering support.
Filters for Semiconductor Equipment
Materion Microlectronics & Services is a premier provider of optical filters used in semiconductor equipment. The two primary filter types used in this equipment are linear variable and narrow band pass. Linear variable filters are unique in that the spectral properties vary in a prescribed way along the lengthwise direction of the filter.
These filters can be used to provide an order sorting function for spectrometers that are used to test the optical and physical properties of semiconductor wafers. Narrow band pass filter types are typically used in conjunction with a mercury light source to transmit discrete spectral lines such as G, H, and I for the exposure function of photolithographic steppers.
Consumer Electronics - Semiconductor Equipment Solutions are Offered By: