With its outstanding stiffness-to-weight ratio and unique thermal properties, the Electronic Materials E-40 metal matrix composite is well-suited for high-performance electronics packaging applications.
Consisting of 60% beryllium, with 40% beryllium oxide, E-40 is a part of the Electronic Materials’ family. Materion Brush Beryllium & Composites’ E-Materials serve the packaging needs for:
Physical Properties of Electronic Materials E-40
Room temperature values:
- Density 2.3 g/cc, 46 Msi Elastic Modulus
Additional Electronic Materials E-40 Facts
Electronic Materials E-40 materials are used as laminated, multi-chip modules in satellites, as heat sinks and in avionics of F-22, F-16, and F-18 tactical fighters.
Along with thermal cycle reliability over a broad temperature range, Electronic Materials E-40’s high elastic modulus helps absorb vibrations, and lowering material fatigue of attached modules and wire bonds.
Electronic Materials E-40 has high thermal conductivity and thermal expansion. Electronic Materials E-40’s thermal expansion can match other materials, silicon and gallium arsenide chips, as well as various ceramics.
Electronic Materials E-40 is produced by impact grinding followed by then hot isostatic pressing. Once in block form, the material is is then sliced into cards, sawn to required shape, polished, machined and optionally plated.
Contact Materion Brush Beryllium and Composites
To learn more about Metal Matrix Composite, Electronic Materials E-40, contact Materion Brush Beryllium and Composites.