Microelectronics Packaging Materials
For over 30 years, Materion has been an industry leader in providing smarter solutions for ceramic packages and hermetic cover/lids for the microelectronics industry. Our high reliability electronic packaging materials are manufactured in a wide variety of standard designs to be responsive to your specific requirements.
The Materion Advantage
We understand your need for consistent high quality materials that perform well under a variety of conditions and contribute to your profitability.
• We can support most configurations, applications and volume requirements
• Our state-of-the-art manufacturing sites around the world minimize lead times
• Our engineers are ready to partner with you to customize innovative electronic package materials for your needs
• Our extensive tooling libraries offer dozens of solder performs and cover lids to fit your application and provide best-cost solutions
Our microelectronic packaging material solutions include:
• Gold bonding wire & ribbon
• Hermetic cover lids including Combo-LidsTM, Micro-LidsTM and Plated Lids
• Solder preforms made from a wide range of lead-containing and lead-free alloys
• Ni-clad molybdenum tabs
• Epoxy-coated ceramic and metal lids
Smarter Solutions, Simpler Support and Stronger Relationships
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