Bonding Wire & Ribbon
Through our proprietary extrusion process, Materion manufactures cleaner and more uniform bonding wire and ribbon for your microelectronic packaging requirements. Our gold bonding ribbon is optimal for high-power applications such as microwave devices where precious metal enables reliable performance.
The Materion Advantage
We combine our engineering expertise and leading-edge hydrostatic extrusion process to provide you with the highest quality gold bonding wire and ribbon available.
• Our process eliminates imperfections due to the extreme pressure that the metal experiences as it passes through the die
• The end product of our process produces smaller, more uniform ball sizes on the bonding pad, which in turn reduces your bonding problems
• The Materion process achieves the necessary metallurgical consistency and winding requirements necessary for gold bonding ribbon applications
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