Materion’s Combo-Lid™ is a leading choice for hermetically sealed microelectronic packages. When you need cover lids for high reliability applications in semiconductor, MEMS, crystal oscillator, medical and optical devices, our unique patented Combo-LidsTM can function in the harshest service environments.
The base metal of our high performance Combo-Lids is KovarTM or Alloy 42, which is plated with nickel and gold flash, and tack welded to a solder perform, usually AuSn eutectic. The nickel layer inhibits corrosion, while the gold layer promotes solderability and ensures a clean particulate-free surface. Tack welding the solder preform to the lid conveniently aligns the solder to the perimeter of the lid, simplifying handling and reducing part count. Hermetic Combo-Lids therefore offer a best-cost solution.
We employ unique capabilities to design and produce hermetic packages.
• Vertically integrated manufacturing operations control quality throughout the entire production process
• Our engineers assist you with customized designs for cover lid, frame size and related tooling
• We produce Combo-LidTM products in the USA, Singapore and the Philippines for near-source distribution
• We recommend process parameters for hermetic seals that ensure maximum assembly line yields
Enabling Technology and Design Guidelines for Combo-LidsTM
View technical information on lid and frame composition, mechanisms for sealing hermetic microelectronic packaging and design guidelines for our high-reliability patented Combo-LidsTM.
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