For customers with a special need for a hermetic lid designed for a microelectronic package with area 0.300 in or less, we offer our patented Micro-Lid™. This high performance lid offers a lower cost alternative to our traditional Combo-Lid™, but with the same advantages in quality and reliability.
The base metal of the Micro-Lid™ is composed of Alloy-42 per ASTM Standard F-30-90. The A42 is plated with 80-100 micro inches of sulfimate Ni, followed by 35-50 micro-inches of Au. It is clad on one side with a full face of 80Au20Sn solder, .0012” ±.0002” thick. A gold over-flash is added to cover the edges to provide your hermetic package with corrosion resistance and to ensure that one side of the lid can be distinguished from the other. Due to the small size of Micro-Lids™, capillary action pulls the liquid solder to the perimeter during reflow.
The MicroLid™ is just one high reliability lid within our product line. Materion offers a full range of best-cost solutions designed for specific hermetic packaging applications. We can partner with you to modify plating and clad properties to meet your exacting requirements. Our staff prides itself on taking an innovative approach to resolve your technical challenges and build trusting customer relationships.
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