When your hermetic package requires a smaller lid composed with non-precious metal solders, our Solder Reflow-Lid™ is an economic alternative to our Combo-Lid™. Typically used for lids that measure less than .200” X .200”, our Solder Reflow-Lids™ eliminate any precious metals in the solder while offering a smarter solution for high reliable performance for microelectronic packages.
We employ unique capabilities to design and produce Solder Reflow-Lids™, just one of Materion’s line of hermetic lid products.
• Lids are manufactured in an atmosphere-controlled furnace by combining a non-precious solder onto the surface of a plated strip for best results
• Strips are stamped into parts that meet your exacting dimensional specifications in a range of sizes
• Solder Reflow-Lids™ provide a best-cost solution for your hermetic packaging lid requirements
• With solder coverage controlled to the lid edge, it easily passes gross leak tests
Solder Reflow-Lids™ with 86Pb 8Bi 4Sn 1Ag1In (WS286 solder) have a melting range of 268°-286°C. Therefore, a furnace profile similar to 80Au 20Sn (WS280 eutectic solder) can be used. For situations calling for a lead- free solder, 95Sn 3.5Ag 1.5Sb (WS226 solder) with a melting range of 218°-226°C is a viable solution. Our engineers can partner with you to customize solders to meet your requirements.
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