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  1. CC-001 BeO Ceramics Thermal Management Solutions

    In high performance electronics, packaging is the limiting factor in electrical circuit efficiency. Specifically, thermal management, along with reliability and the trend toward miniaturization are key factors in successful electronic design.

  2. CC-002 Ceramics Material Properties Chart
  3. CC-003 BW3250
  4. CC-007 Beryllium Oxide Ceramics Design Guide

    This general design guide is intended to outline the parameters having cost impact on beryllium oxide ceramics. As process economics pertaining to other ceramics do not necessarily apply to beryllia, a different set of design rules is necessary.

  5. CC-008 Dry Pressed Ceramics As-Fired or Machined CDDP-10 Rev F
  6. CC-009 Isopressed Ceramics CDI-20 Rev E
  7. CC-010 Extruded Ceramics
  8. CC-013 MPD BeO Still the Choice for High Power RF Packages
  9. CC-014 About Us
  10. CC-015 Press Release Materion Ceramics Introduces Large BeO Ceramic Plates