Sputtering Target Bonding

Total Cost Advantage

One Partnership for Materials and Services

Full OEM Support

Materion...
Smarter Solutions, Simpler Support and Stronger Relationships

The thermal and mechanical integrity of the bond between a sputtering target and its backing plate are essential to ensure optimum sputtering performance and prevent premature target failure.

Considerations in sputtering target bonding material and process selection include the individual physical properties of the sputtering target and backing plate, along with the expected operating temperature ranges. Bonding materials include a variety of traditional and custom alloy compositions. Bonding processes include solder bonding, diffusion bonding, and additional methods of high-temperature bonding.

Strategically located bonding centers provide:

• Sputtering target backing plate cleaning and resurfacing to achieve superior adhesion

• 100% target-backing plate alignment for proper fit of the cathode

• Sputtering target stocking programs for quick turnaround on rebonded targets

Our knowledge of thin film sputtering technology and equipment, combined with our simplified logistics, makes us our customers’ First Choice as a total solutions provider.

Materion can provider all your thin film sputtering target needs. In addition to target bonding, we offer a comprehensive range of materials management services that include:

    • Sputtering target material procurement and fabrication
    • Backing plate refurbishment
    • Precision part and shield kit cleaning
    • Precious metal refining

The combination of our material and service offerings provides you with the lowest Total Cost of Ownership for your sputtering process.

A partial list of equipment platforms we routinely bond for includes:

• Applied Materials

• Novellus

• Singulus