Assembly
Materion Microelectronics and Services continues to be the global leader serving the high reliability microelectronic packaging and assembly industry. We offer a comprehensive array of solutions including hermetic coverlids (including our leading ComboLid™), bonding wire/ribbon, die attach products and specialized packages.
You will find our products in the most demanding applications including Military applications, medical devices, cellular telephones and wireless infrastructure. Often the high reliability of our devices demand the use of precious metals. At Materion Microelectronics and Services, we recognize that these materials increase the total cost solution of the application and we collaborate with our customers to design cost effective minimization or replacement solutions.
Materion Microelectronics and Services maintains two strategically placed manufacturing sites in Asia that are highly focused on full volume production of microelectronic assembly products. We combine our high quality products with localized production to offer the best-cost solution to the market.
Contact Us
With world-wide sales and manufacturing, contact your local Materion Microelectronics and Services representative.
Assembly Is Offered By: