Electroplating - Wirebondable Leadframes - Nickel Phosphorous

Electroplating - Wirebondable Leadframes - Nickel Phosphorous

Challenge of Application:

To create a low-cost electroplated surface for wirebonding.

Materion Solution: 

NiP electroplated copper alloy creates a wirebondable material.  This leadframe system lacks the robust wirebonding process window of aluminum inlay leadframes but in certain applications, it offers an acceptable alternative.

RELATED CHALLENGES:

• Interconnect Systems
• Wire Bonding
• Thermal Management
• Metal Joining

RELATED PROCESS TECHNOLOGIES:

• Inlay Cladding
• Electroplating

Electroplating - Wirebondable Leadframes - Nickel Phosphorous Is Offered By:

• Technical Materials