Thermal Management - Copper Clad Aluminum
Inlay Cladding
Thermal Management - Copper Clad Aluminum
Challenge of Application:
To provide a material that is lightweight with good thermal properties that is also easily soldered.
Materion Solution:
Technical Materials offers aluminum with copper clad either overall or selectively.
RELATED CHALLENGES:
RELATED PROCESS TECHNOLOGIES:
Inlay Cladding - Thermal Management - Copper Clad Aluminum Is Offered By: