Packaging Materials Capabilities
Packaging Materials Capabilities
To support the high level of materials and performance characterization demanded by our markets, Materion Microelectronics and Services has developed one of the industry’s most comprehensive breadth of in house testing and analytical capabilities.
Upon request, these capabilities and infrastructure can often be made available on a fee basis to support our customer’s needs. Some of these testing and analytical capabilities include:
- GDMS
- ICP-MS
- ICP-OES
- LECO
- X-Ray Diffraction
- Particle Size Analysis
- Sieve Analysis
- Corrosion Testing
- Fire Assay
- Magnetic Testing
- Optical Microscopy
- Image Analysis
- Finite Element Modeling
- Tensile Testing
- Hardness Testing
- Microhardness Testing
- Ultrasonic Testing
- DSC/DTA
Contact Us
For additional information, contact Materion Microelectronics and Services today.
Packaging Materials Capabilities Is Offered By: