Site Search
+1 800.327.1355


Materion Advanced Materials is an industry leader providing durable and best-cost solutions for the microelectronics industry. We look forward to meeting you at IMAPS 13th International Conference & Exhibition on Device Packaging in the WekoPa Resort & Casino, Fountain Hills, Arizona from March 7-9, 2017.

The Annual Device Packaging Conference is organized by the International Microelectronics Assembly and Packaging Society (IMAPS). It is a major forum for the exchange of knowledge and provides numerous technical social and networking opportunities for meeting leading experts in these fields. The conference is attended by people from industry and academia and provides a chance for multiple interactions across diverse groups and experience levels.

Visit Materion’s Booth! We offer a comprehensive portfolio of packaging materials in precious or non-precious material and can customize innovative electronic package materials to your unique needs. Learn about CA-Pack, our fully assembled air cavity packaging with copper flange that offers an alternative to conventional air cavity packages. Also, our unique COVERexpress service for expedited delivery of packaging materials.