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Materion Advanced Materials is an industry leader in providing durable and best-cost solutions for the microelectronics industry. We look forward to meeting you at SMTA International in the Donald E. Stephens Convention Center, Rosemont, Illinois from September 17-21, 2017.

SMTA International Conference & Exhibition has the reputation for being the strongest gathering for those industries supporting electronic products and manufacturing. The technical sessions offer unparalleled best original papers on emerging technologies such as alternate alloys, autonomous driving, printed electronics and coating technologies.

Visit Materion at Booth #125! Check out our new product, Bondflow™ Adhesive, as well as our comprehensive portfolio of microelectronic packaging materials in precious or non-precious materials and can customize innovative electronic package materials to satisfy your unique needs. Our high-reliability packaging also supports most configurations, applications and volume requirements.