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A leading supplier of high reliability microelectronic packaging, Materion is excited to re-introduce our products and services at the 2019 IMAPS National conference in Boston on October 1st and 2nd.

Stop by booth #329 to chat with our team about our entire line of microelectronic packaging, including Visi-LidTM covers – our newest hermetic optical cover lid assembly product. Visi-Lid™ covers address the light-sensitive requirements for electronic devices and offers a complete solution for mixing and matching various optical windows onto a wide range of housings. You’ll also want to ask about our CoverExpressTM service – a service that allows you to get your Combo-Lid™ covers, lids, and solder preforms in half the standard lead-time.

Interested in talking to our product experts before the show? Get in touch with our microelectronic packaging experts today.