JOIN MATERION ADVANCED MATERIALS AT THE IMAPS 2020 VIRTUAL EVENT
A leading supplier of high-performance microelectronic packaging and joining alloys, join Materion at the 53rd International Symposium on Microelectronics Virtual Event from October 5 – 8. Stop by our virtual booth to chat with our team about our comprehensive line of microelectronic packaging, including hermetic lids and ceramic packaging lids to braze and solder joining alloys, we’ve got you covered.
Interested in talking to our product experts during the show? Get in touch with our microelectronic packaging experts today.