VISIT MATERION MEP EXPERTS AT THE 2020 IMAPS DEVICE PACKAGING CONFERENCE
A leading supplier of high-performance microelectronic packaging and joining alloys, Materion is will be attending the 2020 IMAPS Device Packaging conference in Fountain Hills, Arizona from March 3 – 5.
The IMAPS Device Packaging conference is a major forum for the exchange of knowledge and provides technical, social and networking opportunities for meeting leading experts in these fields. Attracting a diverse group of people within industry and academia, IMAPS Device Packaging provides a chance for educational interactions across many different functional groups and experience levels.
Stop by Materion's booth - booth #45 - to chat with our team about our entire line of microelectronic packaging. From hermetic and ceramic packaging lids to braze and solder joining alloys, we’ve got you covered. Interested in talking to our product experts before the show? Get in touch with our microelectronic packaging experts today.