Home Businesses Advanced Materials Group Combo Lids Microelectronic Packaging - We’ve Got You Covered! Materion’s Combo-Lids™ are the leading choice for hermetic microelectronic packages To ensure optimal performance and reliability, sensitive electronics must be adequately protected by secure packaging. Materion’s hermetic Combo-Lids™ are necessary for semiconductor, MEMS, medical or optical applications to shield devices from moisture. Our unique patented Combo-Lids™ can function in the harshest service environments. The base metal of our high performance Combo-Lids™ is Kovar™ or Alloy 42, which is plated with nickel and gold flash, and tack-welded to a solder preform, usually AuSn eutectic. The nickel layer promotes solderability while the precious metal (gold) layer inhibits corrosion, ensuring a clean particulate-free surface. Tack-welding the solder preform to the lid conveniently aligns the solder to the perimeter of the lid, simplifying handling and reducing part count. Therefore, hermetic Combo-Lids™ offer a best-cost solution. When it comes to microelectronic packaging, our product line encompasses a full range of lids that can be customized to your specific application. Other available lids include: Micro-Lids™ - for packages smaller than .300 in2 Seam Seal-Lids™ - for sealing heat sensitive electronics Solder Reflow-Lids™ - a cost alternative to Combo-Lid™ Visi-Lids™ - for optical packages Ceramic Combo Lids™ - for specialty applications Epo-Lids™ - Epoxy-coated ceramic for non-hermetic applications View our lid application comparison chart and contact us for more information.