Sputtering targets are used by equipment manufacturers for high-volume production of film for metals, dielectrics, transparent conductors, and AR coatings. Materion has been a leading manufacturer of sputtering targets for decades with experience producing targets to support many markets. These include semiconductor, data storage, wireless, optical, hybrid/micro electronics and performance films. We offer a solution to the key problem in nodule formation: reducing particulate contamination in sputtering targets.
One of the challenges with targets is that they can “grow” nodules as the deposition run proceeds. This can ultimately be detrimental to the customer’s product quality. These nodules tend to form on the surface of sputtering targets near the racetrack region (redeposition zone). They may take the shape of a hillock, cone or pyramid. In an extreme case, nodules can cover more than 30% of the target surface area.
These nodules pose concerns because they can change the sputtering rate and the angular distribution of sputtered atoms, causing arcing, process drift and destabilization. This may eventually result in defects in the sputtered film. These nodule problems can also cause undesired downtime due to the need for frequent cleaning of target surfaces.
Nodule formation on sputtering targets can be influenced by a number of factors, including:
• cleanliness of the process chamber
• arc handling ability of magnetron power source
• temperature of target surface during sputtering
• stability of the process
• particulate contamination in the sputtering targets
• trelative sputtered surface area / redeposition area
Materion partners with you to create enhanced target designs that complement sputtering source designs. These are capable of reducing the relative surface area of redeposited zones where nodules typically form. Through our expertise and superior manufacturing methods, we are able to reduce contamination that leads to nodule growth and poor performance. Materion can also manufacture targets of virtually any material or configuration to the exacting specification of all major equipment OEMs.