Brushform 158 Copper-Nickel-Tin Foil Gauge Alloys

As the consumer electronics industry designs smaller, lighter devices to perform better with constantly increasing capabilities, the materials used to make electronic connectors, switches and sensors should enable and enhance these products. At Materion, we're focused on staying ahead of the industry's needs, and our high-performance BrushForm® 158 (BF 158) strip alloys are engineered specifically to meet the requirements of next-generation devices.

Our spinodally-hardened copper-nickel-tin strip alloys provide optimal strength in foil gauges, making them ideal for use in devices such as smartphones, tablets and cameras. They offer higher strength than other copper alloys, but do not contain beryllium, so they can be used when beryllium-free alloys are desired. The materials are RoHS compliant and infinitely recyclable.

BF 158 alloys are available in both pre-heat treated (mill hardened) and heat treatable (age hardenable) strip forms.

BF 158 strip is engineered to provide optimal formability and increased strength requirements for voice coil motor and optical image stabilizing applications in smartphones and electromagnetic shielding gaskets in electronic devices. BF 158 strip offers substantially higher strength in foil gauges as thin as 0.001” (0.025 mm) for greater design flexibility.

These alloys are available in multiple tempers to meet different application requirements. 

BrushForm alloys outperform copper-beryllium and copper-titanium in applications with high strength/high temperature requirements, and they have good corrosion resistance, which is important for water-resistant devices.

Our copper-nickel-tin strip is specified to UNS C72900, ASTM B 740.