Materion is proud to be your single source for microelectronic packaging materials to protect sensitive electronic devices and components. 

We provide a comprehensive line of microelectronic packaging solutions and expert technical support throughout your product development cycle. Our materials are found within a variety of applications including MEMS devices, autonomous vehicles, aerospace, defense, energy, and medical markets. Ask about our high-reliability hermetic lids, Visi-Lid^TM covers, ceramic packages, preforms, and solder alloys. 

High-Reliability Lids

• Combo-Lid^TM covers that perform in the harshest environments
• Visi-Lid^TM covers to protect photonic devices

Solder Alloys & Preforms

• AuSn solder is made from ultra-pure Au upgraded in our refinery
• Preforms for industries requiring superior joining for sensitive electronics

Ceramic Packages

• RF power transistors
• Custom designs fabricated to your device

Interested in learning more? Schedule a virtual meeting with us during the IMAPS Device Packaging Conference from April 12 - 15!