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For high reliability electrical components, Aluminum Inlay provides the most stable wire bonding surface on copper base metals.  With proven performance in demanding high volume automotive applications such as Electronic Power Steering Modules and Anti-Lock Brake Systems, lead frames manufactured with Aluminum Inlay provide robust manufacturability and stability in the field.

Aluminum Inlay - Wire Bondable Lead Frame Materials

Advantages Include:

      • Superior reliability

      • High temperature and vibration stability

      • Extended shelf life

      • Large process windows

A clad layer of soft aluminum is the highest reliability bond surface for lead frames assembled with aluminum wire bonding.  The high purity aluminum bond pad forms an ultra-stable, self limiting oxide layer that is readily displaced during wire bonding.  Compared to nickel-based alternatives, this provides broad bonding process windows and a superior shelf life. Additionally, aluminum-to-aluminum bonding is highly reliable since there is no potential for voiding or intermetallic formation at the bond site.

Manufactured as a Clad Inlay, the bond layers between copper and aluminum are optimized with controlled heat treatments, providing a robust Cu-Al interface with 10-year stabilities at temperatures up to 200°C.

Typical base materials are Cu based alloys such as C102, C194 and C519. These materials are proven base materials and Materion Technical Materials has over 30 years experience cladding those with wire bondable Al or AlSi inlays. To enable press-fit technology, high strength alloys such as CuNiSi with excellent stress relaxation properties are also available.