Home Products High Performance Alloys EtchMet Alloy ETCHMET™ ALLOY FOR VCM & OIS SPRINGS IN SMARTPHONE CAMERAS Materion is continuously optimizing our alloys to meet the requirements of the most demanding applications. For voice coil motor (VCM) and optical image stabilization (OIS) springs in smartphone cameras, we are pushing the limits of durable, high strength foil gauge strip and wire alloys to meet ever increasing requirements. EtchMet™ alloy is our newest ultra high-strength alloy for VCM and OIS applications. Smartphone designed with EtchMet strip alloy can expect: Increased life & performance of VCM & OIS springs. Shorter autofocus times for smartphone cameras. High durability enabling the spring to withstand impact loads without fracturing or permanently deforming. High fatigue strength that withstands repeated impacts and actuation cycles. Download the EtchMet Alloy brochure ULTRA-HIGH STRENGTH ALLOY: READY FOR VCM & OIS PRODUCTION EtchMet strip alloy is the highest strength alloy for VCM & OIS available. It provides better results than copper titanium (CuTi) and offers many advantages when used in cell phone cameras. The advantages for VCM & OIS designers and manufacturers include: Uniform, primarily single-phase microstructure, which photochemically machines easily and makes uniform edges free of stress risers. Supplied fully precipitation hardened, so no further heat treatment is required. Minimal coil set, helping alignment during photochemical machining. Solders and welds readily. The small size of the springs requires an ultra-high strength material to withstand shock loads in the event the device is dropped. Furthermore, most smartphone designs lack a damping mechanism, so the high spring stiffness will minimize vibration, resulting in faster focusing. Download the EtchMet Alloy TM10 Data Sheet Download the EtchMet Alloy TM20 Data Sheet (Preliminary) ETCHMET™ WIRE ALLOY Due to the relatively large mass of cellphone cameras, consisting of the lenses suspended by extremely small, thin springs, we developed EtchMet wire to suspend and control the VCM / OSI spring. With a uniform elastic modulus across all thicknesses/diameters and between all product forms, EtchMet wire provides consistent stiffness and damping behavior which makes spring calculations easier. Download the EtchMet Wire Data Sheet SEE THE DIFFERENCE BETWEEN ETCHMET & COPPER TITANIUM ALLOYS The results are in, and EtchMet strip outperforms copper titanium alloys. EtchMet alloy TM10 & TM20 vs. CuTi Alloy Properties EtchMet TM10 EtchMet TM20 (preliminary) CuTi Elastic Modulus (Stiffness) 131 GPa 133 GPa 127 GPa Tensile Strength 1260 MPa 1500 MPa 1400 MPa Yield Strength 1200 MPa 1475 MPa - Fatigue Strength (106 cycles) 575 MPa TBD 550 MPa Request more information or a sample from our materials engineers to learn more about EtchMet alloy for VCM and OIS applications.