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HIGH PURITY BRAZE POWDER FOR MICROELECTRONIC PACKAGING REQUIREMENTS


Materion offers a wide range of brazing alloys, including precious metals, with total impurity levels below 100 ppm that provide superior vacuum joining of electronic devices. Our proprietary process yields braze powder with low carbon and oxygen levels for consistent performance. We have the following brazing powders and brazing alloys available.

VARIETY OF BRAZING ALLOYS FOR COST-EFFECTIVE SOLDERING

Our braze powders are available in an array of lead-containing as well as lead-free alloys. Our lead-free alloys include those containing precious metals like silver, gold or palladium. We can custom-blend sieve sizes to meet your specific mesh designations and offer standard mesh sizes in a range from 100/+400, -140/+200 to -200/+325 to -325.

ADVANTAGES OF MATERION BRAZE POWDER AND PASTE

Microelectronic packaging requires that brazing alloys deliver high temperature and high purity for uniform soldering. Materion’s solder and braze powders:

  • Meet vacuum tube grade requirements and conform to AST/AWS braze specifications
  • Exhibit spherical shaped particles and high purity levels for optimal joining
  • Can be formulated into convenient brazing pastes

Looking for brazing alloys that deliver superior joining of microelectronic packaging? Discuss your requirements with our engineers to find the right product to meet your needs.