Home Products Microelectronics Alloys Braze and Solder Alloys Die Attach Solder Preforms EXTENSIVE RANGE OF PREFORMS FOR MICROELECTRONICS PACKAGING With our vast tool library and 30 years of material science expertise, Materion is able to manufacture preforms of the highest quality for enhanced performance. When you need optimal adhesion, our preforms are composed of ultra clean alloys for superior thermal and electrical conductivity. PREFORMS TO MATCH YOUR EXACT REQUIREMENTS Materion fabricates a family of preforms to meet customers’ distinct needs for various materials, shapes and sizes. Our library of preforms includes: Squares, rectangles, discs, washers & frames as well as customized unique shapes Extensive material selection of ultra clean braze alloys for superior thermal and electrical conductivity Lead-free alloys available in high quality materials including gold and silver alloys, gold-tin alloys, gold-germanium alloys, gold-tin-copper alloys, et. al. Standard thicknesses from 0.001” to widths up to 4.500” Very accurate adjustable tools for low volume requests UNIQUE ADVANTAGES OF GOLD-TIN PREFORMS There are a number of benefits in using Materion’s gold alloy preforms. Our preforms have a high reliability in joining gold-plated surfaces for hermetic sealing such as that required for hermetic microelectronics packaging. This product provides: High tensile strength Resistant to corrosion and oxidation Superior thermal and electrical conductivity Excellent wetting properties for lid sealing Consistent solder joints PREFORMS FOR USE IN MULTIPLE APPLICATIONS We manufacture preforms employed in a wide range of industries that require superior joining for use in sensitive electronics such as: High-power semiconductor devices Hermetic microelectronics packaging Military/aerospace/weapon systems RF and microwave devices Communications Measuring devices Contact our technical team to help identify the most suitable material for your application and preforms that will meet your size and shape requirements.