Home Products Microelectronics Packaging Materials BondFlow Adhesive BETTER CHEAPER DIE ATTACH ALTERNATIVE Semiconductor chip assemblers desire a high throughput die attach process that minimizes both cost and the thermal impedance of the bonded dice. Materion’s BondFlow™ adhesive can be deposited onto the backside of a wafer and then B-staged into a non-tacky solid. BondFlow™ offers a new alternative to conventional die attach materials with these advantages: Eliminates the need to dispense an epoxy dot beneath each chip No need to position an epoxy or solder perform beneath each chip Bondline has minimal squeeze-out with top face of chip parallel to substrate (no tilt) Thermal resistance of the bondline is minimized Metallization cost is reduced as the die attach adhesive can stick to bare aluminum and bare ceramics IMPRESSIVE THERMAL CONDUCTIVITY OF BONDFLOW™ Thermal conductivity measurements for Materion’s BondFlow™ were made by the laser flash method ASTM E1461-13, “Standard Test Method for Thermal Diffusivity by the Flash Method.” Freestanding films of cured BondFlow™ were tested by laser flash, in addition to measurements of density and specific heat, resulting in these two properties: The thermal conductivity of cured Silver (Ag) BondFlowTM = 2.4 W/m-K The thermal conductivity of cured Dielectric BondFlowTM = 1.1 W/m-K PROCESS OF DIE ATTACH FOR SEMICONDUCTOR CHIPS Our unique die attach adhesive is composed of silver particles and thermoplastic polyimide, a tough material both physically and chemically. It is a durable substance that provides good thermal and electrical conductivity. The adhesive can be spun or printed onto the backside of a semiconductor wafer and B-staged prior to dicing. A-staged Bondflow™ has a low enough viscosity to be deposited by spin coating, slot-die coating or printing. BondFlow is an ideal die attach adhesive for LEDs, VCSELs and photodiodes. JUST A FEW OF THE BENEFITS OF USER-FRIENDLY BONDFLOW Our unique adhesive can be spin-coated or printed onto a wide variety of surfaces. It adheres well to bare ceramics, silicate (window) glass, metals, CVD diamond and bare silicon. Can be tailored to a particular application by varying viscosity and the filler particles Offers short cycle times and high throughput Spin-coated layers have excellent thickness uniformity B-staged layer is non-tacky with long shelf life at room temperature B-staged coating cures on a hot plate at 250°C after only 2 seconds Pressure during cure: 50 to 100 psi (340 to 690 kPa) Minimal squeeze-out and tilt Cured bond retains adhesion strength even after 3 minutes at 400°C Multiple dice can be bonded in sequence without any movement of each die after cure (similar to AuSn) Dielectric BondFlow also available, with breakdown strength of 140 V/µm There are multiple advantages to using BondFlow™ Adhesive for die attach applications. Discuss your semiconductor chip requirements with one of Materion’s experts today.