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BETTER CHEAPER DIE ATTACH ALTERNATIVE


Semiconductor chip assemblers desire a high throughput die attach process that minimizes both cost and the thermal impedance of the bonded dice. Materion’s BondFlow™ adhesive can be deposited onto the backside of a wafer and then B-staged into a non-tacky solid. BondFlow™ offers a new alternative to conventional die attach materials with these advantages:

  • Eliminates the need to dispense an epoxy dot beneath each chip
  • No need to position an epoxy or solder perform beneath each chip
  • Bondline has minimal squeeze-out with top face of chip parallel to substrate (no tilt)
  • Thermal resistance of the bondline is minimized
  • Metallization cost is reduced as the die attach adhesive can stick to bare aluminum and bare ceramics

IMPRESSIVE THERMAL CONDUCTIVITY OF BONDFLOW™

Thermal conductivity measurements for Materion’s BondFlow™ were made by the laser flash method ASTM E1461-13, “Standard Test Method for Thermal Diffusivity by the Flash Method.” Freestanding films of cured BondFlow™ were tested by laser flash, in addition to measurements of density and specific heat, resulting in these two properties:

  • The thermal conductivity of cured Silver (Ag) BondFlowTM = 2.4 W/m-K
  • The thermal conductivity of cured Dielectric BondFlowTM = 1.1 W/m-K

PROCESS OF DIE ATTACH FOR SEMICONDUCTOR CHIPS

Our unique die attach adhesive is composed of silver particles and thermoplastic polyimide, a tough material both physically and chemically. It is a durable substance that provides good thermal and electrical conductivity. The adhesive can be spun or printed onto the backside of a semiconductor wafer and B-staged prior to dicing. A-staged Bondflow™ has a low enough viscosity to be deposited by spin coating, slot-die coating or printing.

BondFlow Adhesive for Semiconductor Chip Assemblers

BondFlow is an ideal die attach adhesive for LEDs, VCSELs and photodiodes.

JUST A FEW OF THE BENEFITS OF USER-FRIENDLY BONDFLOW

Our unique adhesive can be spin-coated or printed onto a wide variety of surfaces. It adheres well to bare ceramics, silicate (window) glass, metals, CVD diamond and bare silicon.

  • Can be tailored to a particular application by varying viscosity and the filler particles
  • Offers short cycle times and high throughput
  • Spin-coated layers have excellent thickness uniformity
  • B-staged layer is non-tacky with long shelf life at room temperature
  • B-staged coating cures on a hot plate at 250°C after only 2 seconds
  • Pressure during cure: 50 to 100 psi (340 to 690 kPa)
  • Minimal squeeze-out and tilt
  • Cured bond retains adhesion strength even after 3 minutes at 400°C
  • Multiple dice can be bonded in sequence without any movement of each die after cure (similar to AuSn)
  • Dielectric BondFlow also available, with breakdown strength of 140 V/µm

There are multiple advantages to using BondFlow™ Adhesive for die attach applications. Discuss your semiconductor chip requirements with one of Materion’s experts today.