Home Products Microelectronics Packaging Materials Ceramic Packages CA-Pack™ CA-Pack™ Fully assembled air cavity package with copper flange Materion CA-Packs™ are a new alternative to conventional air cavity packages for Si LDMOS and GaN RF power transistors. Our unique pre-assembled packages are convenient and cost effective, saving our customers both time and resources. CA-Packs™ are suitable for the wireless infrastructure market. Featuring frame and leads bonded into a header assembly that is compatible with AuSn die attach at 320°C or nanosilver die attach. Compatible with copper flanges and exotic flange materials Compatible with ear'd and earless flanges Available in the same designs as standard brazed ceramic packages Available in sizes larger than our standard CuPacks™ For more information, contact our experts: Richard Koba: Richard.Koba@materion.com Weichuan Goh: Weichuan.Goh@materion.com MATERION ADVANTAGE You can trust our expertise in producing air cavity packages. Our engineers want to be your partner of choice and identify best cost solutions for your packaging needs. Lower prices than conventional brazed ceramic packages Unmetallized frames enable shorter lead times and reduce manufacturing complexity Copper flanges provide better thermal performance than CuW or CPC flanges Matching Epo-Lids™ available.