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CERAMIC AIR CAVITY PACKAGES

Materion’s ceramic air cavity packages are the industry standard for Si and
GaN RF power transistors.

Our packages for discrete Si, GaAs and GaN RF power transistors offer proven performance & reliability for wireless applications in the 500 MHz to 3.5 GHz frequency range.

Our ceramic air cavity packages feature the following to deliver a consistently high-performing product:

  • High thermal conductivity flange promotes low thermal resistance
  • Alumina ring frames provide very low dielectric loss at RF frequencies
  • Leads are Alloy 42, plated with Ni and Au to provide superlative electrical conduction
  • Brazed construction provides excellent mechanical reliability
  • Ni:Co + Au electrolytic plating is compatible with AuSi eutectic die attach or AuSn eutectic die attach

    Please CONTACT US  for assistance with your packaging needs or
     use the online RF Selector Tool.

MATERION ADVANTAGE 

For over 15 years, we have been a leading manufacturer of electronic packaging for a wide variety of RF power transistors optimized to meet your requirements and maximize best-cost solutions.

  • We offer a variety of high power RF ceramic air cavity packages
  • In addition to our industrial standard outlines, we can partner with you to customize air cavity packages for your demanding applications
  • Our R&D team is ready to assist with new product development or technical support.

 For more information, click on Flange Materials - Materion Now & Next Generation