PATENTED CUPACK™ PACKAGES FOR OUTSTANDING TRANSISTOR PERFORMANCE

Our unique ceramic packages are all electrolytically plated with gold and nickel and are compatible with a wide range of die attach materials. Our high quality CuPacks packages meet exacting standards for low thermal resistance and low RF loss.

EXPERTISE IN PRODUCING INNOVATIVE RF PACKAGES

You can trust Materion’s proven history in producing RF packages for cutting edge, high power Si, GaAs and GaN transistors. Our CuPack packages are manufactured in a wide variety of standard designs, plus new designs can be quickly fabricated from customer specifications with expedited delivery.

TECHNICAL ADVANTAGES OF MATERION CUPACKS PACKAGES

To support requirements for high performance ceramic packages, our CuPack packages offer the following benefits:

Very low thermal resistance with 0.2 mm thick copper leads and base
Very low RF loss with an air cavity and alumina ceramic ringframe
Cavity area up to 3.8mm for 420°C rating
Cavity area up to 5.0mm x 5.0mm for 320°C rating
Direct bond Cu construction with the narrowest lead pitch possible
The CuPack packages are surface mount packages whose leads can be formed in straight, gull wing or J-shaped configurations
Available in industry standard footprints that are interchangeable with many plastic packages

Contact our engineers to discuss best cost solutions for ceramic packages that meet your precise needs.