Home Products Microelectronics Packaging Materials Ceramic Packages Plated Flanges PLATED FLANGES FREE OF SURFACE DEFECTS Materion’s proprietary plating process produces flanges that are free of pits, scratches and other defects that pose a major quality challenge to customers. Our scratch-free surfaces are critical for plated flanges that ensure the best die attach for ceramic packaging. ADVANCED MATERIALS TO CREATE SUPERIOR FLANGES Our variety of advanced material custom-plated flanges can accommodate multiple applications to meet your microelectronics packaging requirements. The choices of materials include: Flanges are plated with Ni:Co + Au for high-performance use in RF transistors, FETs and MMICs Flange material can be pure Cu, Mo or W, or the composites CuW, CuMo, Cu-CuMO lamination (CPC) or Cu-Mo-Cu lamination (CMC) Flanges are plated with electrolytic nickel, copper and gold for reliability Compatible with AuSi eutectic die attach UNIQUE ADVANTAGES OF MATERION PLATED FLANGES Our engineers will partner with you to identify the optimal plated flanges for ceramic packaging that will enable a variety of RF applications. Materion can offer several option including: Substrates for gold-plated BeO pill packages Discrete ringframes that are epoxied onto the flange Circuit boards with cut-outs Meet the exacting standards of the microelectronics packaging industry See how our plated flanges with scratch-free surfaces can improve your die attach. Contact our plate flange experts to discuss the best flange for your ceramic packaging.