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PLATED FLANGES FREE OF SURFACE DEFECTS


Materion’s proprietary plating process produces flanges that are free of pits, scratches and other defects that pose a major quality challenge to customers. Our scratch-free surfaces are critical for plated flanges that ensure the best die attach for ceramic packaging.

ADVANCED MATERIALS TO CREATE SUPERIOR FLANGES

Our variety of advanced material custom-plated flanges can accommodate multiple applications to meet your microelectronics packaging requirements. The choices of materials include:

  • Flanges are plated with Ni:Co + Au for high-performance use in RF transistors, FETs and MMICs
  • Flange material can be pure Cu, Mo or W, or the composites CuW, CuMo, Cu-CuMO lamination (CPC) or Cu-Mo-Cu lamination (CMC)
  • Flanges are plated with electrolytic nickel, copper and gold for reliability
  • Compatible with AuSi eutectic die attach

UNIQUE ADVANTAGES OF MATERION PLATED FLANGES

Our engineers will partner with you to identify the optimal plated flanges for ceramic packaging that will enable a variety of RF applications. Materion can offer several option including:

  • Substrates for gold-plated BeO pill packages
  • Discrete ringframes that are epoxied onto the flange
  • Circuit boards with cut-outs
  • Meet the exacting standards of the microelectronics packaging industry

See how our plated flanges with scratch-free surfaces can improve your die attach. Contact our plate flange experts to discuss the best flange for your ceramic packaging.